High temperature thermoelectric properties of TiNiSn-based half-Heusler compounds

被引：130

作者：

Kim, Sung-Wng ^{[1
]}

Kimura, Yoshisato ^{[1
]}

Mishima, Yoshinao ^{[1
]}

机构：

[1] Tokyo Inst Technol, Frontier Collaborat Res Ctr, Midori Ku, Dept Mat Sci & Engn,Interdisciplinary Grad Sch Sc, Yokohama, Kanagawa 2268503, Japan

来源：

INTERMETALLICS | 2007年 / 15卷 / 03期

关键词：

ternary alloy systems; thermoelectric properties; powder metallurgy;

D O I：

10.1016/j.intermet.2006.08.008

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A class of intermetallics of TiNiSn half-Heusler compound with MgAgAs structure type is currently of interest as a potential high temperature thermoelectric material. The ternary TiNiSn compound has showed promising thermoelectric properties, a high Seebeck coefficient and low electrical resistivity. The present study reports the effect of Hf alloying on Ti site, Pt and Pd alloying on Ni site, and Sb doping on Sn site for the optimization of thermoelectric properties of TiNiSn-based compounds. Also, to achieve a low thermal conductivity, a powder metallurgy technique is used for the fabrication of the compounds. These efforts result in the dimensionless figure of merit, ZT as 0.78 for the hot-pressed (Ti0.95Hf0.05)Ni(Sn0.99Sb0.01) sample at 770 K with a large power factor (4.1 mW/mK(2)), which makes these materials very attractive for potential power generation applications. (c) 2006 Elsevier Ltd. All rights reserved.

引用

页码：349 / 356

页数：8

共 14 条

[1] Grain structure effects on the lattice thermal conductivity of Ti-based half-Heusler alloys [J].