Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate Part 1. Thermal properties, microstructure, corrosion and oxidation resistance

被引：41

作者：

Chang, Tao-Chih

Wang, Jian-Wen

Wang, Moo-Chin

Hon, Min-Hsiung

机构：

[1] Natl Kaohsiung Univ Appl Sci, Dept Mech Engn, Kaohsiung 80782, Taiwan

[2] Da Yeh Univ, Changhua, Taiwan

[3] Chung Hwa Coll Med Technol, Dept Environm & Safety Engn, Tainan 71703, Taiwan

[4] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2006年 / 422卷 / 1-2期

关键词：

lead-free solder; heat of fusion; corrosion resistance; oxidation;

D O I：

10.1016/j.jallcom.2005.09.094

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 [物理化学]; 081704 [应用化学];

摘要：

The thermal properties, microstructure corrosion and oxidation resistance of the Sn-9Zn-0.5Ag-1In lead-free solder have been investigated by differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, potentiostat and thermogravimetry. The Sn-9Zn-0.5Ag-1In solder alloy has a near-eutectic composition, it melts at 187.6 degrees C and the heat of fusion is determined as 71.3 J/g. The Sn-9Zn-0.5Ag-1In solder alloy with a corrosion potential Of -1.09 V-SCE and a current density of 9.90 x 10(-2) A/cm(2), shows a better corrosion resistance than that of the Sn-9Zn solder alloy. From the thermogravimetry analysis, the weight gain ratio of the Sn-9Zn solder alloy appears a parabolic relationship at 150 degrees C. The initial oxidation behavior of the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Ag-1In solder alloys also shows a parabolic relationship but the weight gain ratio of them appears a negative linear one after aging at 150 degrees C for 2.5 and 5 h, respectively. (c) 2005 Elsevier B.V. All rights reserved.

引用

页码：239 / 243

页数：5

共 24 条

[1]

Brown M.E., 1988, INTRO THERMAL ANAL, p[33, 34]

[2]

Determination of reactive wetting properties of Sn, Sn-Cu, Sn-Ag, and Sn-Pb alloys using a wetting balance technique [J].