Solid-state reactions at the Sn-9Zn-xAg lead-free solders/Cu interface

被引：7

作者：

Chang, TC ^{[1
]}

Hon, MH

Wang, MC

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

[2] Natl Kaohsiung Univ Appl Sci, Dept Engn Mech, Kaohsiung 80782, Taiwan

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 2003年 / 6卷 / 06期

关键词：

D O I：

10.1149/1.1566534

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 [应用化学];

摘要：

The solid-state reactions at the interface of Sn-9Zn-xAg lead-free solders/Cu have been investigated by X-ray diffractometer (XRD), scanning electron microscope (SEM), transmission electron microscope (TEM), and energy dispersive spectrometer (EDS). The XRD pattern shows that gamma-Cu5Zn8, Cu6Sn5, and Ag3Sn intermetallic compounds (IMCs) were formed at the Sn-9Zn-xAg/Cu interface and the quantity increased during long-term aging. The SEM, TEM, and EDS results indicate that Cu interdiffused to the solder and reacted with Sn to form Cu6Sn5 at the interface after aging at 150degreesC for 750 h. Cu3Sn IMC formed in the matrix of the Sn-9Zn-1.5Ag solder alloy after aging. (C) 2003 The Electrochemical Society.

引用

页码：C82 / C84

页数：3

共 13 条

[1]

Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging [J].