Interfaces and stresses in thin films

被引：469

作者：

Spaepen, F ^{[1
]}

机构：

[1] Harvard Univ, Div Engn & Appl Sci, Cambridge, MA 02138 USA

来源：

ACTA MATERIALIA | 2000年 / 48卷 / 01期

基金：

美国国家科学基金会;

关键词：

physical vapor deposition; thin films; interfaces; grain boundaries; stress;

D O I：

10.1016/S1359-6454(99)00286-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A review of the current understanding of the effect of interfaces on the intrinsic stresses in polycrystalline thin films is given. Special attention is paid to the measurement, modeling and application of surface and interface stresses. Mechanisms for generating the compressive and tensile components of the intrinsic stress are assessed. Prospects for future research are presented. (C) 2000 Published by Elsevier Science Ltd on behalf of Acta Metallurgica Inc. All rights reserved.

引用

页码：31 / 42

页数：12

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