INSITU STUDY OF THIN-FILM GROWTH BY INTERNAL-STRESS MEASUREMENT UNDER ULTRAHIGH-VACUUM CONDITIONS - SILVER AND COPPER UNDER THE INFLUENCE OF OXYGEN

被引：37

作者：

ABERMANN, R

KOCH, R

机构：

来源：

THIN SOLID FILMS | 1986年 / 142卷 / 01期

关键词：

D O I：

10.1016/0040-6090(86)90303-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

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页码：65 / 76

页数：12

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共 15 条

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[10] ON THE INFLUENCE OF THERMAL EFFECTS ON INTERNAL-STRESS MEASUREMENTS DURING AND AFTER DEPOSITION OF SILVER, GOLD AND COPPER-FILMS [J].

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