Fabrication of new micromachined transmission line with dielectric posts for millimeter-wave applications

被引：6

作者：

Lee, HS ^{[1
]}

Shin, DH ^{[1
]}

Kim, SC ^{[1
]}

Lim, BO ^{[1
]}

Baek, TJ ^{[1
]}

Ko, BS ^{[1
]}

Chun, YH ^{[1
]}

Kim, SK ^{[1
]}

Park, HC ^{[1
]}

Rhee, JK ^{[1
]}

机构：

[1] Dongguk Univ, Millimeter Wave Innovat Technol Res Ctr, Seoul 100175, South Korea

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2004年 / 14卷 / 05期

关键词：

D O I：

10.1088/0960-1317/14/5/013

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

This paper describes a new Gaiks-based surface-micromachined microstrip line supported by dielectric posts and with an air gap between the signal line and the ground metal. This new type of dielectric post and air-gapped microstripline (DAML) structure was developed using surface micromachining techniques to provide an easy means of air-bridge connection between the signal lines and to achieve low losses in the millimeter-wave frequency band with a wide impedance range. Each DAML is fabricated with a length of 5 mm. By elevating the signal lines from the substrate using micromachining technology, the substrate dielectric loss can be reduced. Compared with conventional microstrip transmission lines, which show over 10 dB cm(-1) loss, the loss of a DAML can be reduced to 1.1 dB cm(-1) at 50 GHz.

引用

页码：746 / 749

页数：4

共 10 条

[1]

ARNOLD RG, 1992, P 42 EL COMP TECHN C, P18

[2]

HENRI H, 2000, MICR S 2000 IEEE MTT, V3, P1809

[3]

Kamitsuna H., 1992, IEEE Microwave and Guided Wave Letters, V2, P337, DOI 10.1109/75.153606

[4]

Katehi L. P. B., 1993, IEEE Antennas and Propagation Magazine, V35, P9, DOI 10.1109/74.242171

[5]

New micromachined microstrip transmission lines for application in millimeter-wave circuits [J].

Lee, HS ;

Kim, SC ;

Lim, BO ;

Kim, KM ;

Uhm, WY ;

Chun, YH ;

Shin, DH ;

Kim, SK ;

Park, HC ;

Rhee, JK .

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2004, 40 (01) :6-9

[6]

5-100 GHZ INP COPLANAR WAVE-GUIDE MMIC DISTRIBUTED-AMPLIFIER [J].

MAJIDIAHY, R ;

NISHIMOTO, CK ;

RIAZIAT, M ;

GLENN, M ;

SILVERMAN, S ;

WENG, SL ;

PAO, YC ;

ZDASIUK, GA ;

BANDY, SG ;

TAN, ZCH .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1990, 38 (12) :1986-1993

[7]

Micromachined microwave transmission lines in CMOS technology [J].

Milanovic, V ;

Gaitan, M ;

Bowen, ED ;

Zaghloul, ME .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (05) :630-635

[8]

Characterization of thin film microstrip lines on polyimide [J].

Ponchak, GE ;

Downey, AN .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1998, 21 (02) :171-176

[9]

High frequency transmission line using micromachined polymer dielectric [J].

Thorpe, JR ;

Steenson, DP ;

Miles, RE .

ELECTRONICS LETTERS, 1998, 34 (12) :1237-1238

[10]

WILLKE TL, 1996, MICR S IEEE MTTS INT, P1189

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