A study of interface states of directly bonded silicon-on-insulator structures

被引:6
作者
Buldygin, SA [1 ]
Golod, SV [1 ]
Kamaev, GN [1 ]
Skok, EM [1 ]
机构
[1] Russian Acad Sci, Inst Semicond Phys, Novosibirsk 630090, Russia
关键词
silicon-on-insulator; bonding; interface defects; microwave transient photoconductivity;
D O I
10.1016/S0022-0248(99)00657-0
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
The traps at the interface of directly bonded silicon-on-insulator structures have been investigated for the first time using a contactless and nondestructive computer controlled microwave transient photoconductivity method. It is shown that during bonding process electrically active states appear at the interface. The values of activation energies and capture cross-sections of charge carriers are obtained which are associated with the presence of the interface states similar to those at the Si/thermal oxide interface. (C) 2000 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:107 / 111
页数:5
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