Fundamental limit of gate oxide thickness scaling in advanced MOSFETs

被引:34
作者
Hirose, M
Koh, M
Mizubayashi, W
Murakami, H
Shibahara, K
Miyazaki, S
机构
[1] Hiroshima Univ, Fac Engn, Dept Elect Engn, Higashihiroshima 7398527, Japan
[2] Hiroshima Univ, Res Ctr Nanodevices & Syst, Higashihiroshima 7398527, Japan
[3] Japan Sci & Technol Corp, CREST, Yokohama, Kanagawa, Japan
关键词
D O I
10.1088/0268-1242/15/5/308
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The statistical distribution of the direct tunnel leakage current through the ultrathin gate oxides of MOSFETs induces significant fluctuations in the threshold voltage and the transconductance when the gate oxide tunnel resistance becomes comparable to the gate poly-Si resistance. By calculating the measured tunnel current based on multiple scattering theory, it is shown that the threshold voltage and the transconductance fluctuations will be problematic when the gate oxide thickness is scaled down to about 0.8 nm.
引用
收藏
页码:485 / 490
页数:6
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