Numerical simulation of quantum effects in high-k gate dielectric MOS structures using quantum mechanical models

被引:28
作者
Li, YM [1 ]
Lee, JW
Tang, TW
Chao, TS
Lei, TF
Sze, SM
机构
[1] Natl Chiao Tung Univ, Microelect & Informat Syst Res Ctr, Inst Elect, Hsinchu 300, Taiwan
[2] Natl Nano Device Labs, Hsinchu 300, Taiwan
[3] Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01033 USA
[4] Natl Chiao Tung Univ, Dept Electrophys, Hsinchu 300, Taiwan
关键词
MOS capacitor; high-k dielectric; quantum mechanical models; numerical methods;
D O I
10.1016/S0010-4655(02)00248-5
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
In this paper the electrical characteristics of metal oxide semiconductor (MOS) capacitors with high-k gate dielectric are investigated with quantum mechanical models. Both the self-consistent Schrodinger-Poisson (SP) model and the density gradient (DG) model are solved simultaneously to study quantum confinement effects (QCEs) for MOS capacitors. A computationally efficient parallel eigenvalue solution algorithm and a robust monotone iterative (MI) finite volume (FV) scheme for the SP and DG models are systematically proposed and successfully implemented on a Linux cluster, respectively. With the developed simulator, we can extract the effective gate oxide thickness from capacitance voltage (C-V) measurements for TaN and Al gate NMOS capacitors with ZrO2 and SiO2 gate dielectric materials. We found that quantization effects of 5.0 nut Z(r)O(2) MOS samples cannot be directly equivalent to commonly quoted effects of 1.5 nm SiO2 MOS samples. Achieved benchmarks are also included to demonstrate excellent performances of the proposed computational techniques. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:214 / 217
页数:4
相关论文
共 17 条
[1]   MACROSCOPIC DESCRIPTION OF QUANTUM-MECHANICAL TUNNELING [J].
ANCONA, MG .
PHYSICAL REVIEW B, 1990, 42 (02) :1222-1233
[2]   Equations of state for silicon inversion layers [J].
Ancona, MG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2000, 47 (07) :1449-1456
[3]   1.5nm equivalent thickness Ta2O5 high-k dielectric with rugged Si suited for mass production of high density DRAMs [J].
Asano, I ;
Kunitomo, M ;
Yamamoto, S ;
Furukawa, R ;
Sugawara, Y ;
Uemura, T ;
Kuroda, J ;
Kanai, M ;
Nakata, M ;
Tamaru, T ;
Nakamura, Y ;
Kawagoe, T ;
Yamada, S ;
Kawakita, K ;
Kawamura, H ;
Nakamura, M ;
Morino, M ;
Kisu, T ;
Iijima, S ;
Ohji, Y ;
Sekiguchi, T ;
Tadaki, Y .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :755-758
[4]   Error estimates on the approximate finite volume solution of convection diffusion equations with general boundary conditions [J].
Gallouët, T ;
Herbin, E ;
Vignal, MH .
SIAM JOURNAL ON NUMERICAL ANALYSIS, 2000, 37 (06) :1935-1972
[5]  
JESSUP ER, 1994, SIAM J MAT ANAL APPL, V15, P1201
[6]  
LI Y, 2001, TECH P INT C MOD SIM, P562
[7]  
LI Y, 2001, P 3 WSES IEEE INT C, P4511
[8]   A new parallel adaptive finite volume method for the numerical simulation of semiconductor devices [J].
Li, YM ;
Liu, JL ;
Chao, TS ;
Sze, SM .
COMPUTER PHYSICS COMMUNICATIONS, 2001, 142 (1-3) :285-289
[9]  
LIU W, 2000, IEEE T EDUC, V46, P1070
[10]   Modeling and characterization of quantization, polysilicon depletion, and direct tunneling effects in MOSFETs with ultrathin oxides [J].
Lo, SH ;
Buchanan, DA ;
Taur, Y .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1999, 43 (03) :327-337