Effects of alloying in near-eutectic tin-silver-copper solder joints

被引：12

作者：

Anderson, IE ^{[1
]}

Cook, BA ^{[1
]}

Harringa, J ^{[1
]}

Terpstra, RL ^{[1
]}

Foley, JC ^{[1
]}

Unal, O ^{[1
]}

机构：

[1] Iowa State Univ, Ames Lab, Ames, IA 50011 USA

来源：

MATERIALS TRANSACTIONS | 2002年 / 43卷 / 08期

关键词：

lead-free solder tin (Sn)-silver (Ag)-copper (Cu) solders; joint shear strength; joint microstructure; solder joint solidification;

D O I：

10.2320/matertrans.43.1827

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This study included a comparison of the baseline Sn-3.5Ag eutectic to one near-eutectic ternary alloy, Sn-3.6Ag-1.0Cu and two quaternary alloys, Sn-16Ag-1.0Cu-0.15Co and Sn-3.6Ag-1.0Cu-0.45Co, to increase understanding of the effects of Co on Sn-Ag-Cu solder joints cooled at 1-3degreesC/s., typical of reflow assembly practice. The results revealed joint microstructure refinement due to Co-enhanced nucleation of the Cu6Sn5 phase in the solder matrix, as suggested by Auger elemental mapping and calorimetric measurements. The Co also reduced inter-metallic interface faceting and improved the ability of the solder joint samples to maintain their shear strength after aging for 72 h at 150degreesC. Some recent additional results with Co and Fe additions are consistent with this catalysis effect, where a reduced total solute level was tested. The baseline Sn-3.5Ag joints exhibited significantly reduced strength retention and coarser microstructures.

引用

页码：1827 / 1832

页数：6

共 17 条

[11]

*JAP EL IND DEV AS, 2000, CHALL EFF COMM LEAD

[12] Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish [J].