Study on fence-free platinum etching using chlorine-based gases in inductively coupled plasma

被引:18
作者
Chung, CW
Song, HG
机构
[1] Samsung Adv. Institute of Technology, Electronic Materials Laboratory, Materials Sector
关键词
D O I
10.1149/1.1838073
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Platinum thin films have been successfully etched without redeposition of etch products using chlorine-based gases in an inductively coupled plasma. The redeposited materials formed on the pattern sidewall by using Cl-2/Ar gas combination were analyzed by x-ray photoelectron spectroscopy and secondary ion mass spectrometry. We found that the redeposited material was mainly PtCl2 compound. Based on this result, SiCl4/Cl-2/Ar gas chemistry has been proposed as a new etching gas and demonstrated good etching profile of Pt films without unwanted redeposition.
引用
收藏
页码:L294 / L296
页数:3
相关论文
共 17 条
[11]   Integration technology of ferroelectrics and the performance of the integrated ferroelectrics [J].
Shimada, Y ;
Nagano, Y ;
Fujii, E ;
Azuma, M ;
Uemoto, Y ;
Sumi, T ;
Judai, Y ;
Hayashi, S ;
Moriwaki, N ;
Nakane, J ;
Otsuki, T ;
deAraujo, CAP ;
McMillan, LD .
INTEGRATED FERROELECTRICS, 1995, 11 (1-4) :229-245
[12]   MICROSTRUCTURAL EVOLUTION OF PB(ZR, TI)O3 THIN-FILMS PREPARED BY HYBRID METALLOORGANIC DECOMPOSITION [J].
TUTTLE, BA ;
HEADLEY, TJ ;
BUNKER, BC ;
SCHWARTZ, RW ;
ZENDER, TJ ;
HERNANDEZ, CL ;
GOODNOW, DC ;
TISSOT, RJ ;
MICHAEL, J ;
CARIM, AH .
JOURNAL OF MATERIALS RESEARCH, 1992, 7 (07) :1876-1882
[13]  
VANGLABBEEK JJ, 1993, MATER RES SOC S P, V310, P127
[14]  
WEAST RC, 1988, CRC HDB CHEM PHYSICS, pB114
[15]   X-RAY PHOTOELECTRON SPECTROSCOPIC STUDY OF THE INTERACTIONS OF FLUORINE IONS WITH GALLIUM-ARSENIDE [J].
WILLISTON, LR ;
BELLO, I ;
LAU, WM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1992, 10 (04) :1365-1370
[16]   HIGH-TEMPERATURE ETCHING OF PZT/PT/TIN STRUCTURE BY HIGH-DENSITY ECR PLASMA [J].
YOKOYAMA, S ;
ITO, Y ;
ISHIHARA, K ;
HAMADA, K ;
OHNISHI, S ;
KUDO, J ;
SAKIYAMA, K .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (2B) :767-770
[17]   Control of etch slope during etching of Pt in Ar/Cl-2/O-2 plasmas [J].
Yoo, WJ ;
Hahm, JH ;
Kim, HW ;
Jung, CO ;
Koh, YB ;
Lee, MY .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (4B) :2501-2504