Materials growth for InAs high electron mobility transistors and circuits

被引:30
作者
Bennett, BR [1 ]
Tinkham, BP
Boos, JB
Lange, MD
Tsai, R
机构
[1] USN, Res Lab, Washington, DC 20375 USA
[2] Northrop Grumman Space Technol Inc, Redondo Beach, CA 90278 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2004年 / 22卷 / 02期
关键词
D O I
10.1116/1.1667507
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High electron mobility transistors (HEMTs) with InAs channels and antimonide barriers were grown by molecular beam epitaxy. Both Si and Te were successfully employed as n-type dopants. Sheet resistances of 90-150 Omega/square were routinely achieved on a variety of heterostructures with nonuniformities as low as 1.5% across a 75 mm wafer. X-ray diffraction measurements show that the InAs channels are in tension, coherently strained to the Al(Ga)Sb buffer layers. Atomic force microscopy measurements demonstrate that the surfaces are relatively smooth, with rms roughness of 8-26 Angstrom over a 5 x 5 mum(2) area. These results demonstrate that the growth of InAs HEMTs has progressed to the point that the fabrication of circuits should be feasible. (C) 2004 American Vacuum Society.
引用
收藏
页码:688 / 694
页数:7
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