Etch stop techniques for micromachining

被引:47
作者
Collins, SD
机构
[1] Damien Associates, Davis
关键词
D O I
10.1149/1.1837773
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
A presentation of etch stop engineering is presented with a review of the present state of the art in etch stop micromachining. This review assumes a global definition for an etch stop and focuses on salient examples of common etch stop techniques, as well as unique and/or novel etch stop methods. A table of representative etch stops is also presented as a summary.
引用
收藏
页码:2242 / 2262
页数:21
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共 380 条
[71]   FABRICATION OF CATHETER-TIP AND SIDEWALL MINIATURE PRESSURE SENSORS [J].
ESASHI, M ;
KOMATSU, H ;
MATSUO, T ;
TAKAHASHI, M ;
TAKISHIMA, T ;
IMABAYASHI, K ;
OZAWA, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1982, 29 (01) :57-63
[72]   PERFORMANCE IMPROVEMENT OF CIRCULAR-GRATING SURFACE-EMITTING DBR LASERS USING AN MQW STRUCTURE WITH ETCH-STOP LAYER [J].
FALLAHI, M ;
DION, M ;
WASILEWSKI, Z ;
BUCHANAN, M ;
NOURNIA, M ;
STAPLEDON, J ;
BARBER, R .
ELECTRONICS LETTERS, 1995, 31 (18) :1581-1582
[73]   IC-PROCESSED ELECTROSTATIC MICROMOTORS [J].
FAN, LS ;
TAI, YC ;
MULLER, RS .
SENSORS AND ACTUATORS, 1989, 20 (1-2) :41-47
[74]   INTEGRATED MOVABLE MICROMECHANICAL STRUCTURES FOR SENSORS AND ACTUATORS [J].
FAN, LS ;
TAI, YC ;
MULLER, RS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1988, 35 (06) :724-730
[75]   Photoluminescence and electroluminescence from porous silicon [J].
Fauchet, PM .
JOURNAL OF LUMINESCENCE, 1996, 70 :294-309
[76]  
FAUST JW, 1983, J ELECTROCHEM SOC, V130, P1413, DOI 10.1149/1.2119964
[77]  
FAUST JW, 1959, SURFACE CHEM METALS, P151
[78]   THE ROLE OF THE LATENT IMAGE IN A NEW DUAL IMAGE, AQUEOUS DEVELOPABLE, THERMALLY STABLE PHOTORESIST [J].
FEELY, WE ;
IMHOF, JC ;
STEIN, CM .
POLYMER ENGINEERING AND SCIENCE, 1986, 26 (16) :1101-1104
[79]  
FEELY WE, 1986, P SOC PHOTO-OPT INS, V631, P49
[80]   EPITAXIAL SI-GE ETCH-STOP LAYERS WITH ETHYLENE DIAMINE PYROCATECHOL FOR BONDED AND ETCHBACK SILICON-ON-INSULATOR [J].
FEIJOO, D ;
BEAN, JC ;
PETICOLAS, LJ ;
FELDMAN, LC ;
LIANG, WC .
JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (06) :493-496