Role of the hydrogen plasma treatment in layer-by-layer deposition of microcrystalline silicon

被引:58
作者
Saitoh, K [1 ]
Kondo, M [1 ]
Fukawa, M [1 ]
Nishimiya, T [1 ]
Matsuda, A [1 ]
Futako, W [1 ]
Shimizu, I [1 ]
机构
[1] TOKYO INST TECHNOL,GRAD SCH,MIDORI KU,YOKOHAMA,KANAGAWA 226,JAPAN
关键词
D O I
10.1063/1.120324
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have investigated the role of hydrogen in hydrogenated microcrystalline silicon (mu c-Si:H) formation using hydrogen plasma treatments, in particular examining the possibility of subsurface reaction due to permeating hydrogen atoms, which leads to the crystallization of hydrogenated amorphous silicon (a-Si:H). It is demonstrated that the hydrogen plasma treatment of a-Si:H film on the anode using a cathode covered by a-Si:H film, which is inevitably coated during the deposition period, gives rise to the deposition of mu c-Si:H over the a-Si:H layer, i.e., chemical transport takes place. It is also found that the pure hydrogen plasma treatment using a clean cathode induces only etching of the a-Si:H layer. These results imply that the present hydrogen plasma condition does not cause crystallization of a-Si:H but only etching, and that careful experimentation is required to determine the real subsurface reaction due to atomic hydrogen. (C) 1997 American Institute of Physics.
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页码:3403 / 3405
页数:3
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