Silicon carbide PiN and merged PiN Schottky power diode models implemented in the Saber circuit simulator

被引:43
作者
McNutt, TR [1 ]
Hefner, AR
Mantooth, HA
Duliere, J
Berning, DW
Singh, R
机构
[1] Univ Arkansas, Dept Elect Engn, Fayetteville, AR 72701 USA
[2] Natl Inst Stand & Technol, Div Semicond Elect, Gaithersburg, MD 20899 USA
[3] Synopsys Inc, Hillsboro, OR 97124 USA
[4] Cree Inc, Durham, NC 27703 USA
基金
美国国家科学基金会;
关键词
Circuit simulation; Diode model; Merged PiN schottky; PiN; Power diode; Reverse recovery; Schottky; SiC;
D O I
10.1109/TPEL.2004.826420
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Dynamic electrothermal circuit simulator models are developed for silicon carbide power diodes. The models accurately describe the temperature dependence of on-state characteristics and reverse-recovery switching waveforms. The models are verified for the temperature dependence of the on-state characteristics, and the di/dt, dv/dt, and temperature dependence of the reverse-recovery characteristics. The model results are presented for 1500 V SiC Merged PiN Schottky (MPS) diodes, 600 V Schottky diodes, and 5000 V SiC PiN diodes. The devices studied have current ratings from 0.25 A to 5 A and have different lifetimes resulting in different switching energy versus on-state voltage tradeoffs. The devices are characterized using a previously reported test system specifically designed to emulate a wide range of application conditions by independently controlling the applied diode voltage, forward diode current, di/dt, and dv/dt at turn-off. A behavioral model of the test system is implemented to simulate and validate the models. The models are validated for a wide range of application conditions for which the diode could be used.
引用
收藏
页码:573 / 581
页数:9
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