Preparation of ultrathin layers of polythiophene covalently bonded to silicon

被引：22

作者：

Fikus, A ^{[1
]}

Plieth, W

Appelhans, D

Ferse, D

Adler, HJ

Adolphi, B

Schmitt, FJ

机构：

[1] Tech Univ Dresden, Inst Phys Chem & Elektrochem, D-01062 Dresden, Germany

[2] Tech Univ Dresden, Inst Makromol Chem & Text Chem, D-01062 Dresden, Germany

[3] Tech Univ Dresden, Inst Halbleiter & Mikrosyst Tech, D-01062 Dresden, Germany

[4] Inst Polymerforsch Dresden EV, D-01069 Dresden, Germany

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1999年 / 146卷 / 12期

关键词：

D O I：

10.1149/1.1392668

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Adhesive polythiophene films were formed in a new two-step procedure using 11-(3-thienyl)undecyltrichlorosilane as a surface coupling agent and a chemical polymerization for reinforcing the film. Coating experiments were carried out on several substrates which are interesting for many kinds of applications. Adherent junctions were available, for instance, on etched silicon and SiO2, TiO2. polished aluminum, and quartz substrates for piezoelectric elements. Polymer films on silicon surfaces were characterized by ellipsometry, scanning electron microscopy, atomic force microscopy, X-ray photoelectron spectroscopy, and Raman microscopy. (C) 1999 The Electrochemical Society. S0013-4651(99)03-127-4. All rights reserved.

引用

页码：4522 / 4525

页数：4

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