Low-temperature wafer-scale 'WARM' embossing for mix & match with UV-lithography

被引：5

作者：

Schulz, H ^{[1
]}

Wissen, M ^{[1
]}

Roos, N ^{[1
]}

Scheer, HC ^{[1
]}

Pfeiffer, K ^{[1
]}

Gruetzner, G ^{[1
]}

机构：

[1] Univ Wuppertal, D-42119 Wuppertal, Germany

来源：

EMERGING LITHOGRAPHIC TECHNOLOGIES VI, PTS 1 AND 2 | 2002年 / 4688卷

关键词：

nanoimprint lithography; UV lithography; mix and match; low temperature embossing; wafer scale;

D O I：

10.1117/12.472295

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The combination of nanoimprint (hot embossing) and UV-lithography has been demonstrated. For this purpose an UV-sensitive epoxy based resin (mr-L 6000-1 xp) with a low glass temperature (T-g) was prepared by adding low molecular weight components, in particular by increasing the monomer content. The suitability of our approach to minimise process temperatures was tested by embossing and UV-lithography. Mix and match of both techniques was used to demonstrate that the embossing step did not degrade the UV sensitivity of the material. UV processing provided in addition a simple means for stabilisation of this low T, material. Resists like mr-L 6000-1 xp may close the gap between "hot embossing", "UV-molding" and UV-Iithography.

引用

页码：223 / 231

页数：5

共 20 条

[1] Imprint lithography with sub-10 nm feature size and high throughput [J].