Surface tension powered self-assembly of 3-D micro-optomechanical structures

被引:93
作者
Syms, RRA [1 ]
机构
[1] Univ London Imperial Coll Sci Technol & Med, Opt & Semiconductor Devices Sect, Dept Elect & Elect Engn, London SW7 2BT, England
基金
英国工程与自然科学研究理事会;
关键词
MEMS; microactuator; micromirror; MOEMS; scanner; self-assembly; 3-D microstructure;
D O I
10.1109/84.809060
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new surface micromachining process for surface tension powered self-assembly of silicon-based microstructures is described. Mechanical parts are formed from bonded silicon-on-insulator material and rotated out-of-plane by melting photoresist pads at low temperature. Simple mechanisms that allow accurate control of the final angle are introduced and used to construct fixed 45 degrees mirrors and scanning mirror assemblies. [435].
引用
收藏
页码:448 / 455
页数:8
相关论文
共 38 条
[1]  
Allen M. G., 1989, Proceedings: IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots (IEEE Cat. No.89THO249-3), P76, DOI 10.1109/MEMSYS.1989.77965
[2]   MOVABLE MICROMACHINED SILICON PLATES WITH INTEGRATED POSITION SENSING [J].
ALLEN, MG ;
SCHEIDL, M ;
SMITH, RL ;
NIKOLICH, AD .
SENSORS AND ACTUATORS A-PHYSICAL, 1990, 21 (1-3) :211-214
[3]   Bulk silicon microelectromechanical devices fabricated from commercial bonded and etched-back silicon-on-insulator substrates [J].
Benitez, A ;
Esteve, J ;
Bausells, J .
SENSORS AND ACTUATORS A-PHYSICAL, 1995, 50 (1-2) :99-103
[4]  
Bhardwaj JK, 1995, P SOC PHOTO-OPT INS, V2639, P224, DOI 10.1117/12.221279
[5]   Scanning and rotating micromirrors using thermal actuators [J].
Butler, JT ;
Bright, VM ;
Reid, JR .
OPTICAL SCANNING SYSTEMS: DESIGN AND APPLICATIONS, 1997, 3131 :134-144
[6]   Linear microvibromotor for positioning optical components [J].
Daneman, MJ ;
Tien, NC ;
Solgaard, O ;
Pisano, AP ;
Lau, KY ;
Muller, RS .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1996, 5 (03) :159-165
[7]   Dynamic actuation of polyimide V-groove joints by electrical heating [J].
Ebefors, T ;
Kalvesten, E ;
Stemme, G .
SENSORS AND ACTUATORS A-PHYSICAL, 1998, 67 (1-3) :199-204
[8]   New small radius joints based on thermal shrinkage of polyimide in V-grooves for robust self-assembly 3D microstructures [J].
Ebefors, T ;
Kalvesten, E ;
Stemme, G .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1998, 8 (03) :188-194
[9]   INTEGRATED MOVABLE MICROMECHANICAL STRUCTURES FOR SENSORS AND ACTUATORS [J].
FAN, LS ;
TAI, YC ;
MULLER, RS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1988, 35 (06) :724-730
[10]   Improved surface-micromachined hinges for fold-out structures [J].
Friedberger, A ;
Muller, RS .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1998, 7 (03) :315-319