New multichip-on-silicon packaging scheme for microsystems

With the increasing complexity of integrated electronic circuit and sensor chips, the need for efficient packaging schemes becomes acute. Ideally one wants a high degree of flexibility, the possibility of accommodating chips with different functionalities, a high packaging density, good mechanical and thermal properties, a large heat-removal capacity and compatibility with automated assembly. In this work we present a new multichip-on-silicon (MCSi) packaging scheme with these characteristics. We show how it can be applied with the example of an optoelectronic microsystem.