Investigation of the transition region between SiO2 layers wet grown at 700 degrees C and Si

被引:4
作者
Anwand, W
Brauer, G
Coleman, PG
Goodyear, A
Reuther, H
Maser, K
机构
[1] UNIV E ANGLIA,SCH PHYS,NORWICH 4NR 7TJ,NORFOLK,ENGLAND
[2] ROSSENDORF INC,FORSCHUNGSZENTRUM ROSSENDORF EV,INST IONENSTRAHLPHYS & MAT FORSCH,D-01314 DRESDEN,GERMANY
[3] TECH UNIV BERLIN,INST MIKROELEKT & FESTKORPERELEKT,D-10623 BERLIN,GERMANY
关键词
D O I
10.1088/0953-8984/9/14/009
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
Silicon oxide layers wet grown at 700 degrees C on silicon substrates of integrated circuit quality have been investigated by slow-positron-implantation spectroscopy and Auger electron spectroscopy. The total thickness of pure SiO2 on top of a SiO2/Si transition zone is determined by ellipsometric measurements; the positron/Auger results indicate that the transition zone extends over 15-23 nm. Its thickness decreases as the SiO2 layer is thinned by a wet-chemical process at room temperature. The results are consistent with earlier secondary-neutral mass spectroscopy measurements.
引用
收藏
页码:2947 / 2954
页数:8
相关论文
共 16 条
[1]  
ANWAND A, 1995, POSITRON BEAMS SOLID, V88, P1
[2]   CHARACTERIZATION OF DEFECTS IN SI AND SIO2-SI USING POSITRONS [J].
ASOKAKUMAR, P ;
LYNN, KG ;
WELCH, DO .
JOURNAL OF APPLIED PHYSICS, 1994, 76 (09) :4935-4982
[3]   POSITRON STUDIES OF METAL-OXIDE-SEMICONDUCTOR STRUCTURES [J].
AU, HL ;
ASOKAKUMAR, P ;
NIELSEN, B ;
LYNN, KG .
JOURNAL OF APPLIED PHYSICS, 1993, 73 (06) :2972-2976
[4]   KINETIC SMOOTHENING - GROWTH THICKNESS DEPENDENCE OF THE INTERFACE WIDTH OF THE SI(001)/SIO2 INTERFACE [J].
DAWSON, JL ;
KRISCH, K ;
EVANSLUTTERODT, KW ;
TANG, MT ;
MANCHANDA, L ;
GREEN, ML ;
BRASEN, D ;
HIGASHI, GS ;
BOONE, T .
JOURNAL OF APPLIED PHYSICS, 1995, 77 (09) :4746-4749
[5]  
*FISONS INSTR, 1993, GJHT80 FISONS
[6]   Chemical structures of the SiO2/Si interface [J].
Hattori, T .
CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1995, 20 (04) :339-382
[7]   PREFERENTIAL SPUTTERING OF ARGON ION-BOMBARDED NI3AL AND TASI2 [J].
HOFMANN, S ;
STEPANOVA, MG .
APPLIED SURFACE SCIENCE, 1995, 90 (02) :227-233
[8]  
KATZ LE, 1988, VLSI TECHNOLOGY, P98
[9]   ELECTRON ESCAPE DEPTH IN SILICON [J].
KLASSON, M ;
BERNDTSSON, A ;
HEDMAN, J ;
NILSSON, R ;
NYHOLM, R ;
NORDLING, C .
JOURNAL OF ELECTRON SPECTROSCOPY AND RELATED PHENOMENA, 1974, 3 (06) :427-434
[10]  
KRAUSER J, 1996, THESIS TU BERLIN, P535