Fabrication of Si field emitter arrays integrated with metal-oxide-semiconductor field-effect transistor driving circuits

被引:19
作者
Nagao, M
Tamura, Y
Matsukawa, T
Kanemaru, S
Itoh, J
Tokunaga, K
机构
[1] AIST, Natl Inst Adv Ind Sci & Technol, Tsukuba, Ibaraki 3058568, Japan
[2] Tokai Univ, Hiratsuka, Kanagawa 2591292, Japan
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2002年 / 20卷 / 06期
关键词
D O I
10.1116/1.1520553
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Si field emitter arrays (FEAs) were monolithically integrated with metal-oxide-semiconductor field-effect-transistor (MOSFET) based driving circuits on a Si chip for the first step toward developing the field-emission-display-on-a-chip (FED-on-a-chip), which is a candidate for,the next-generation FED. We developed a fabrication process of Si FEAs integrated with MOSFET driving circuits. A 4X4 matrix Si FEA, emission-control MOSFET, and simple driving circuits consisting of a shift register were integrated on the same chip. The operation of each element, such as MOSFET controlled Si FEAs and logic circuits for the driver, was confirmed. The emission current from the Si FEA can be controlled by the built-in MOSFET at a voltage of less than 5 V, which can be driven by the built-in driving circuits: The operation of the 4 X 4 matrix FEA with driving circuits was demonstrated. This is the first operation of the FEA integrated with MOSFET logic circuits. The detailed design and fabrication processes are described. 2002 American Vacuum Society.
引用
收藏
页码:2309 / 2313
页数:5
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