Thin films of aluminum nitride and aluminum gallium nitride for cold cathode applications

被引:72
作者
Sowers, AT [1 ]
Christman, JA [1 ]
Bremser, MD [1 ]
Ward, BL [1 ]
Davis, RF [1 ]
Nemanich, RJ [1 ]
机构
[1] N CAROLINA STATE UNIV,DEPT MAT SCI & ENGN,RALEIGH,NC 27695
关键词
D O I
10.1063/1.120052
中图分类号
O59 [应用物理学];
学科分类号
摘要
Cold cathode structures have been fabricated using Al0N and graded AlGaN structures (deposited on n-type 6H-SiC) as the thin film emitting layer. The cathodes consist of an aluminum grid layer separated from the nitride layer by a SiO2 layer and etched to form arrays of either 1, 3, or 5 mu m holes through which the emitting nitride surface is exposed. After fabrication, a hydrogen plasma exposure was employed to activate the cathodes. Cathode devices with 5 mu m holes displayed emission for up to 30 min before failing, Maximum emission currents ranged from 10-100 nA and required grid voltages ranging from 20-110 V. The grid currents were typically 1 to 10(4) times the collector currents. (C) 1997 American Institute of Physics.
引用
收藏
页码:2289 / 2291
页数:3
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