Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper

被引：20

作者：

Chan-Park, MB

Tan, SS

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

[2] Megachem Pte Ltd, Singapore 639588, Singapore

来源：

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 2002年 / 22卷 / 06期

关键词：

plasma; polyimide; adhesion; graft;

D O I：

10.1016/S0143-7496(02)00057-X

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

The surface of poly[N, N'-(oxydiphenylene)pyromellitimide] film, Kapton(R) HN, was modified to improve its adhesion to copper metal. The polyimide surface was argon plasma activated and then exposed to air. A nitrogen-containing monomer, 4-vinyl pyridine, was then polymerized at elevated temperature under constant pressure between the argon plasma activated polyimide film and copper foil without any added photoinitiator. Optimization of the argon pretreatment time, curing temperature and curing duration resulted in almost doubling of the single lap shear strength. It is postulated that failure occurred mainly between the polyimide and the poly(4-vinyl pyridine). (C) 2002 Elsevier Science Ltd. All rights reserved.

引用

页码：471 / 475

页数：5

共 19 条

[1] Low-temperature graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils - effect of crosslinking agents [J].