Electromigration-induced plastic deformation in passivated metal lines

被引：68

作者：

Valek, BC ^{[1
]}

Bravman, JC

Tamura, N

MacDowell, AA

Celestre, RS

Padmore, HA

Spolenak, R

Brown, WL

Batterman, BW

Patel, JR

机构：

[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA

[2] Adv Light Source, Berkeley, CA 94720 USA

[3] Bell Labs, Lucent Technol, Murray Hill, NJ 07974 USA

[4] Stanford Synchrotron Radiat Labs, Stanford, CA 94309 USA

来源：

APPLIED PHYSICS LETTERS | 2002年 / 81卷 / 22期

关键词：

D O I：

10.1063/1.1525880

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in situ electromigration experiment on a passivated Al(Cu) test line. The data show plastic deformation and grain rotations occurring under the influence of electromigration, seen as broadening, movement, and splitting of reflections diffracted from individual metal grains. We believe this deformation is due to localized shear stresses that arise due to the inhomogeneous transfer of metal along the line. Deviatoric stress measurements show changes in the components of stress within the line, including relaxation of stress when current is removed. (C) 2002 American Institute of Physics.

引用

页码：4168 / 4170

页数：3

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