Thermally assisted hole tunneling at the Au-Si3N4 interface and the energy-band diagram of metal-nitride-oxide-semiconductor structures

被引:66
作者
Gritsenko, VA
Meerson, EE
Morokov, YN
机构
[1] Russian Acad Sci, Inst Semicond Phys, Siberian Branch, Novosibirsk 630090, Russia
[2] Russian Acad Sci, Inst Computat Technol, Siberian Branch, Novosibirsk 630090, Russia
关键词
D O I
10.1103/PhysRevB.57.R2081
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermally assisted tunneling of holes at the Au-Si3N4 interface was experimentally observed. The hole barrier of 1.6+/-0.2 eV and the effective masses for the hole and electron tunneling into silicon nitride have been determined. A revised energy-band diagram of the metal-nitride-oxide-semiconductor structure is constructed.
引用
收藏
页码:R2081 / R2083
页数:3
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