Electromigration in Sn-Pb solder strips as a function of alloy composition

被引：141

作者：

Liu, CY ^{[1
]}

Chen, C ^{[1
]}

Tu, KN ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2000年 / 88卷 / 10期

关键词：

D O I：

10.1063/1.1319327

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 10(5) A/cm(2) near ambient temperature. The six compositions are pure Sn, Sn80Pb20, Sn70Pb30, Sn62Pb38 (eutectic), Sn40Pb60, and Sn5Pb95. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation. (C) 2000 American Institute of Physics. [S0021-8979(00)01823-5].

引用

页码：5703 / 5709

页数：7

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