RF MEMS switches fabricated on microwave-laminate printed circuit boards

被引:30
作者
Chang, HP [1 ]
Qian, JY
Cetiner, BA
De Flaviis, F
Bachman, M
Li, GP
机构
[1] Univ Calif Irvine, Dept Elect Engn & Comp Sci, Irvine, CA 92697 USA
[2] Univ Calif Irvine, Dept Elect & Comp Engn, Irvine, CA 92697 USA
[3] Univ Calif Irvine, Integrated Nanosyst Res Facil, Irvine, CA 92697 USA
关键词
compressive-molding planarization; high-density; inductively coupled plasma chemical vapor deposition (HDICP-CVD); printed circuit board (PCB); reconfigurable antennas; RF MEMS switches;
D O I
10.1109/LED.2003.812150
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel fabrication process has been developed for directly constructing radio frequency microelectrical mechanical systems (RF MEMS) capacitive switches on microwave-laminate printed circuit boards (PCBs). The integrated process uses metal wet etching to form-the metal lines for coplanar waveguides, compressive molding planarization (COMP) to planarize uneven surface heights for switch membrane formation, and high-density, inductively coupled plasma chemical vapor deposition (HDICP-CVD) for low-temperature silicon nitride deposition. This technology promises the potential of further monolithic integration with antennas on the same PCBs to form reconfigurable antennas without the concerns of mismatching among components.
引用
收藏
页码:227 / 229
页数:3
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