Fracture and Delamination of Chromium Thin Films on Polymer Substrates

被引：75

作者：

Cordill, M. J. ^{[1
,2
]}

Taylor, A. ^{[1
,2
]}

Schalko, J. ^{[3
]}

Dehm, G. ^{[1
,2
]}

机构：

[1] Austrian Acad Sci, Erich Schmid Inst Mat Sci, A-8700 Leoben, Austria

[2] Univ Leoben, Dept Mat Phys, A-8700 Leoben, Austria

[3] Austrian Acad Sci, Res Unit Integrated Sensor Syst, A-2700 Wiener Neustadt, Austria

来源：

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2010年 / 41A卷 / 04期

关键词：

SHEAR-STRENGTH; IN-SITU; RESIDUAL-STRESS; YIELD STRENGTH; COPPER-FILMS; CRACKING; INTERFACE; STRAIN; INTERCONNECTS; POLYIMIDE;

D O I：

10.1007/s11661-009-9988-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

New emerging technologies in the field of flexible electronic devices require that metal films adhere well and flex with polymer substrates. Common thin film materials used for these applications include copper (Cu) with an adhesion interlayer of chromium (Cr). Copper can be quite ductile and easily move with the polymer substrate. However, Cr is more brittle and fractures at lower strains than Cu. This study aims to examine the fracture and subsequent buckling and delamination of strained Cr films on polyimide (PI). In-situ scanning electron microscope (SEM) straining is used to systematically study the influence of film thickness on fracture and buckling strains. Film fracture and delamination depend on film thickness, and increases in crack and buckle density with decreasing thickness are explored by a shear lag model.

引用

页码：870 / 875

页数：6

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