A 0.1-μm delta-doped MOSFET fabricated with post-low-energy implanting selective epitaxy

A simple fabrication technology for delta-doped MOSFET's, named post-low-energy implanting selective epitaxy (PLISE) is presented, The PLISE technology needs no additional photo-lithography mask, deposition step or etching step even for CMOS devices, The only additional step is growing undoped epitaxial channel layers by UHV-CVD after the channel implantation, With this technology, the delta-doped NMOSFET's with 0.1-mu m gate length were successfully fabricated. By optimizing the epi-layer thickness and the channel doping level, short-channel effects are suppressed enough to achieve 0.1-mu m gate length, Moreover, the junction capacitance at zero bias is reduced by 50%.