Fabrication of a band-reject filter using dielectric-supported air-gapped microstriplines

被引：2

作者：

Baek, TJ ^{[1
]}

Ko, BS ^{[1
]}

Shin, DH ^{[1
]}

Kim, SC ^{[1
]}

Lim, BO ^{[1
]}

Kim, SK ^{[1
]}

Park, HC ^{[1
]}

Rhee, JK ^{[1
]}

机构：

[1] Dongguk Univ, MINT, Millimeter Wave Innovat Technol Res Ctr, Seoul 100715, South Korea

来源：

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2005年 / 44卷 / 01期

关键词：

RF MEMS; surface micromachining; microstrip line; airbridge; DAML; bond reject filter;

D O I：

10.1002/mop.20530

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

In this paper, we develop a new type of band-reject filter, which provides the! practical usefulness of dielectric-supported air-gapped microstriplines. The filter is composed of a signal line of 10-mum height in order to reduce the substrate dielectric loss mid a post of size 20 x 20 mum(2) that supports the signal line. The fabricated band-reject filter has a measured reject band of 46.6 dB at 45 GHz and a pass band of 1.7 dB at 60 GHz. (C) 2004 Wiley Periodicals, Inc.

引用

页码：1 / 4

页数：4

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