Computation of the equivalent capacitance of a via in a multilayered board using the closed-form Green's function

被引:24
作者
Oh, KS
SchuttAine, JE
Mittra, R
Wang, B
机构
[1] Department of Electrical and Computer Engineering, Electromagnetic Communication Laboratory, University of Illinois, Urbana
关键词
D O I
10.1109/22.481589
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A method based on the quasi-static approximation for computing the equivalent capacitance of a via is presented in this paper. The geometry of a via consists of traces, pads and a perfectly conducting cylindrical rod; the via is buried in a multilayered dielectric medium with optional reference (ground) planes. The total number of traces, pads, and ground planes can be arbitrary, as well as the angles and cross sections. The method is based on the excess charge formulation of an integral equation applied in conjunction with the recently developed closed-form Green's function.
引用
收藏
页码:347 / 349
页数:3
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