A novel integrated decoupling capacitor for MCM-L technology

被引:87
作者
Chahal, P [1 ]
Tummala, RR [1 ]
Allen, MG [1 ]
Swaminathan, M [1 ]
机构
[1] Georgia Inst Technol, Atlanta, GA 30332 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1998年 / 21卷 / 02期
基金
美国国家科学基金会;
关键词
barium titanate (BaTiO3); decoupling capacitor; filled-polymer; integrated; large-area; lead magnesium niobate; MCM-L; polyimide; polynorbornene;
D O I
10.1109/96.673707
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper discusses the design, materials, fabrication, and measurements of a novel integrated decoupling capacitor for MCM-L-based substrates. Based on modeling using the Semiconductor Industry Association Roadmap. it has been estimated that 13-72 nF/cm(2) of specific decoupling capacitance will be required for the next decade, The capacitor in this paper addresses this need. The fabrication of the capacitor has been achieved using filled polymer materials in thin film form, with via diameters of 100 mu m and below, through photodefinable processes. Dielectric constant as high as 65 with loss tangent below 0.05 and specific capacitance of 22 nF/cm(2) hale been achieved. The scattering parameters were measured up to 20 GHz using a network analyzer for various capacitor structures (varying geometry and dielectric thickness) to study input impedance and scaling of the devices.
引用
收藏
页码:184 / 193
页数:10
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