Atomic layer chemical vapor deposition of ZrO2-based dielectric films:: Nanostructure and nanochemistry

被引:44
作者
Dey, SK [1 ]
Wang, CG
Tang, D
Kim, MJ
Carpenter, RW
Werkhoven, C
Shero, E
机构
[1] Arizona State Univ, Ctr Solid State Sci, Tempe, AZ 85287 USA
[2] ASM Amer Inc, Phoenix, AZ 85034 USA
关键词
D O I
10.1063/1.1555257
中图分类号
O59 [应用物理学];
学科分类号
摘要
A 4 nm layer of ZrOx (targeted xsimilar to2) was deposited on an interfacial layer (IL) of native oxide (SiO, tsimilar to1.2 nm) surface on 200 mm Si wafers by a manufacturable atomic layer chemical vapor deposition technique at 300 degreesC. Some as-deposited layers were subjected to a postdeposition, rapid thermal annealing at 700 degreesC for 5 min in flowing oxygen at atmospheric pressure. The experimental x-ray diffraction, x-ray photoelectron spectroscopy, high-resolution transmission electron microscopy, and high-resolution parallel electron energy loss spectroscopy results showed that a multiphase and heterogeneous structure evolved, which we call the Zr-O/IL/Si stack. The as-deposited Zr-O layer was amorphous ZrO2-rich Zr silicate containing about 15% by volume of embedded ZrO2 nanocrystals, which transformed to a glass nanoceramic (with over 90% by volume of predominantly tetragonal-ZrO2 (t-ZrO2) and monoclinic-ZrO2 (m-ZrO2) nanocrystals) upon annealing. The formation of disordered amorphous regions within some of the nanocrystals, as well as crystalline regions with defects, probably gave rise to lattice strains and deformations. The interfacial layer (IL) was partitioned into an upper SiO2-rich Zr silicate and the lower SiOx. The latter was substoichiometric and the average oxidation state increased from Si0.86+ in SiO0.43 (as-deposited) to Si1.32+ in SiO0.66 (annealed). This high oxygen deficiency in SiOx was indicative of the low mobility of oxidizing specie in the Zr-O layer. The stacks were characterized for their dielectric properties in the Pt/{Zr-O/IL}/Si metal oxide-semiconductor capacitor (MOSCAP) configuration. The measured equivalent oxide thickness (EOT) was not consistent with the calculated EOT using a bilayer model of ZrO2 and SiO2, and the capacitance in accumulation (and therefore, EOT and k(Zr-O)) was frequency dispersive, trends well documented in literature. This behavior is qualitatively explained in terms of the multilayer nanostructure and nanochemistry that evolves. (C) 2003 American Institute of Physics.
引用
收藏
页码:4144 / 4157
页数:14
相关论文
共 88 条
[71]  
ROBINSON K, 1971, AM MINERAL, V56, P782
[72]   Transmission electron microscopy study of zirconia-alumina nanolaminates grown by reactive sputter deposition. Part I: zirconia nanocrystallite growth morphology [J].
Schofield, MA ;
Aita, CR ;
Rice, PM ;
Gajdardziska-Josifovska, M .
THIN SOLID FILMS, 1998, 326 (1-2) :106-116
[73]   INVESTIGATION OF MOS CAPACITORS WITH THIN ZRO2 LAYERS AND VARIOUS GATE MATERIALS FOR ADVANCED DRAM APPLICATIONS [J].
SHAPPIR, J ;
ANIS, A ;
PINSKY, I .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1986, 33 (04) :442-449
[74]  
Sillars R.W., 1937, J I ELECT ENG, V80, P378, DOI 10.1049/pws.1937.0015
[75]   ANALYSIS OF VALENCE SHELL ELECTRONIC EXCITATIONS IN SILICON AND ITS REFRACTORY COMPOUNDS USING ELECTRON-ENERGY LOSS MICROSPECTROSCOPY [J].
SKIFF, WM ;
CARPENTER, RW ;
LIN, SH .
JOURNAL OF APPLIED PHYSICS, 1988, 64 (11) :6328-6335
[76]   CRYSTAL STRUCTURE OF BADDELEYITE ( MONOCLINIC ZRO2 ) AND ITS RELATION TO POLYMORPHISM OF ZRO2 [J].
SMITH, DK ;
NEWKIRK, HW .
ACTA CRYSTALLOGRAPHICA, 1965, 18 :983-+
[77]   Atomic and ionic processes of silicon oxidation [J].
Stoneham, AM ;
Szymanski, MA ;
Shluger, AL .
PHYSICAL REVIEW B, 2001, 63 (24)
[78]   Interfacial silicon oxide formation during synthesis of ZrO2 on Si(100) [J].
Sun, YM ;
Lozano, J ;
Ho, H ;
Park, HJ ;
Veldman, S ;
White, JM .
APPLIED SURFACE SCIENCE, 2000, 161 (1-2) :115-122
[79]  
SZE SM, 1993, PHYSICS SEMICONDUCTO
[80]   Progress toward 10nm CMOS devices [J].
Timp, G ;
Bourdelle, KK ;
Bower, JE ;
Baumann, FH ;
Boone, T ;
Cirelli, R ;
Evans-Lutterodt, K ;
Garno, J ;
Ghetti, A ;
Gossmann, H ;
Green, M ;
Jacobson, D ;
Kim, Y ;
Kleiman, R ;
Klemens, F ;
Kornblit, A ;
Lochstampfor, C ;
Mansfield, W ;
Moccio, S ;
Muller, DA ;
Ocola, LE ;
O'Malley, ML ;
Rosamilia, J ;
Sapjeta, J ;
Silverman, P ;
Sorsch, T ;
Tennant, DM ;
Timp, W ;
Weir, BE .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :615-618