Strain partition of Si/SiGe and SiO2/SiGe on compliant substrates

被引:26
作者
Yin, H [1 ]
Hobart, KD
Kub, FJ
Shieh, SR
Duffy, TS
Sturm, JC
机构
[1] Princeton Univ, Ctr Photon & Optoelect Mat, Princeton, NJ 08544 USA
[2] Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA
[3] USN, Res Lab, Washington, DC 20375 USA
[4] Princeton Univ, Dept Geosci, Princeton, NJ 08544 USA
关键词
D O I
10.1063/1.1578168
中图分类号
O59 [应用物理学];
学科分类号
摘要
Strain partitioning of crystalline Si and amorphous SiO2 deposited on crystalline SiGe on a compliant viscous borophosphorosilicate (BPSG) glass has been observed. Pseudomorphic epitaxial Si was deposited on SiGe films, which were fabricated on BPSG by wafer bonding and the Smart-cut(R) process. The strains in SiGe and Si films were found to change identically during a high-temperature anneal which softened the BPSG film, indicating a coherent interface between SiGe and Si films and precluding slippage or the formation of misfit dislocations along the interface. The stress balance between the layers dictated the final state, which confirmed that BPSG was a perfectly compliant substrate and did not exert any force on the layers above it. Similar results were found for amorphous SiO2 deposited on SiGe on BPSG and then annealed. This shows that the viscous BPSG is an effective compliant substrate for the strain engineering of elastic films without the introduction of dislocations. (C) 2003 American Institute of Physics.
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页码:3853 / 3855
页数:3
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