EFFECT OF WATER-VAPOR ON THE NUCLEATION AND GROWTH OF CHEMICAL-VAPOR-DEPOSITED COPPER-FILMS ON SPIN-COATED POLYIMIDE

The effect of water vapor on the mechanisms of nucleation and growth of metallo-organic chemical vapor deposited copper films from copper (II) hexafluoroacetylacetonate [Cu(hfa)2] on a polyimide substrate has been investigated. Minimal copper deposition was observed on the polyimide substrate in the absence of water vapor. When water vapor was introduced into the system, blanket copper deposition was observed on the whole polyimide surface. The initial nucleation and growth of copper film on polyimide is initiated by the reaction between the vapor phase precursor and water vapor not the surface chemistry reaction between the vapor phase precursor and the substrate. Copper film growth on the polyimide substrate can thus be attributed to an initial oxidation of the organic ligand by water vapor followed by reduction of the resulting copper oxide by hydrogen. © 1995 American Institute of Physics.