ACTIVATED REACTIVE ION PLATING (ARIP)

被引:26
作者
MOLL, E
BUHL, R
PULKER, HK
BERGMANN, E
机构
关键词
D O I
10.1016/S0257-8972(89)80009-X
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:475 / 486
页数:12
相关论文
共 44 条
[21]   PHYSICAL VAPOR-DEPOSITION OF THICK CR AND ITS CARBIDE AND NITRIDE FILMS BY HOLLOW-CATHODE DISCHARGE [J].
KOMIYA, S ;
TSURUOKA, K .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01) :520-524
[22]  
LUCAS MSP, 1962, AM VAC SCO T, V2, P988
[23]  
MACLEOD HA, 1987, 1987 P INT S TRENDS, V1, P43
[24]   DEVELOPMENTS IN IONIZATION ASSISTED PROCESSES [J].
MATTHEWS, A .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06) :2354-2363
[25]  
Mattox D.M., 1964, ELECTROCHEM TECHNOL, V2, P95
[26]  
MOLL E, 1980, Patent No. 4197175
[27]  
MOLL E, 1989, IN PRESS P IPAT 89 G
[28]  
MOLL E, 1985, Patent No. 4555611
[29]  
MORLEY JR, 1971, Patent No. 3562141
[30]  
PLYUTTO AA, 1965, SOV PHYS JETP-USSR, V20, P328