CHANGES IN RESISTIVITY AND COMPOSITION OF CHEMICAL VAPOR-DEPOSITED TUNGSTEN SILICIDE FILMS BY ANNEALING

被引:17
作者
SHIOYA, Y
ITOH, T
KOBAYASHI, I
MAEDA, M
机构
关键词
D O I
10.1149/1.2108938
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:1475 / 1479
页数:5
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共 12 条
[1]  
AKIMOTO K, 1981, APPL PHYS LETT, V39, P445
[2]  
BRORS DL, 1983, SOLID STATE TECHNOL, V26, P183
[3]   A NEW MOSI2/THIN POLY-SI GATE PROCESS TECHNOLOGY WITHOUT DIELECTRIC DEGRADATION OF A GATE OXIDE [J].
FUKUMOTO, M ;
SHINOHARA, A ;
OKADA, S ;
KUGIMIYA, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1984, 31 (10) :1432-1439
[4]   INTERFACIAL REACTION IN POLYCIDE MOS GATE STRUCTURE EMPLOYING CVD TUNGSTEN SILICIDE [J].
HARA, T ;
ENOMOTO, S ;
JINBO, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1984, 23 (07) :L455-L457
[5]  
HORIGUCHI F, 1985, ISSCC, P244
[6]  
ITOH K, 1984, ISSCC, P280
[7]   REFRACTORY SILICIDES FOR INTEGRATED-CIRCUITS [J].
MURARKA, SP .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1980, 17 (04) :775-792
[8]  
Ohyama Y., 1983, Journal of the Vacuum Society of Japan, V26, P831, DOI 10.3131/jvsj.26.831
[9]   ANALYSIS OF STRESS IN CHEMICAL VAPOR-DEPOSITION TUNGSTEN SILICIDE FILM [J].
SHIOYA, Y ;
ITOH, T ;
INOUE, SI ;
MAEDA, M .
JOURNAL OF APPLIED PHYSICS, 1985, 58 (11) :4194-4199
[10]  
SHIOYA Y, UNPUB J APPL PHYS