RADIATION-HARDENED N-CHANNEL MOSFET ACHIEVED BY A COMBINATION OF POLYSILICON SIDEWALL AND SIMOX TECHNOLOGY

被引:9
作者
OHNO, T
IZUMI, K
SHIMAYA, M
SHIONO, N
机构
[1] NTT Electrical Communications Lab, Atsugi, Jpn, NTT Electrical Communications Lab, Atsugi, Jpn
关键词
D O I
10.1049/el:19860381
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
5
引用
收藏
页码:559 / 560
页数:2
相关论文
共 5 条
[1]   TOTAL DOSE RADIATION-BIAS EFFECTS IN LASER-RECRYSTALLIZED SOI MOSFETS [J].
DAVIS, GE ;
HUGHES, HL ;
KAMINS, TI .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1982, 29 (06) :1685-1689
[2]   MOS HARDNESS CHARACTERIZATION AND ITS DEPENDENCE UPON SOME PROCESS AND MEASUREMENT VARIABLES [J].
HUGHES, GW ;
POWELL, RJ .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1976, 23 (06) :1569-1572
[3]   SIMOX TECHNOLOGY AND ITS APPLICATION TO CMOS LSIS [J].
IZUMI, K ;
OMURA, Y ;
SAKAI, T .
JOURNAL OF ELECTRONIC MATERIALS, 1983, 12 (05) :845-861
[4]   CMOS DEVICES FABRICATED ON BURIED SIO2 LAYERS FORMED BY OXYGEN IMPLANTATION INTO SILICON [J].
IZUMI, K ;
DOKEN, M ;
ARIYOSHI, H .
ELECTRONICS LETTERS, 1978, 14 (18) :593-594
[5]   ELECTRIC-FIELD-SHIELDING LAYERS FORMED BY OXYGEN IMPLANTATION INTO SILICON [J].
NAKASHIMA, S ;
AKIYA, M ;
KATO, K .
ELECTRONICS LETTERS, 1983, 19 (15) :568-570