COPPER DISTRIBUTIONS IN SPUTTERED AL-SI-CU ELECTRODE

被引：4

作者：

HARA, T ^{[1
]}

OHTSUKA, N ^{[1
]}

TAKEDA, T ^{[1
]}

YOSHIMI, T ^{[1
]}

机构：

[1] HITACHI LTD,MUSASHI WORKS,KODAIRA,TOKYO 187,JAPAN

来源：

关键词：

D O I：

10.1149/1.2108941

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1489 / 1491

页数：3

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[2]

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[3]

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[4]

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[5]

HARA T, UNPUB JPN J APPL PHY

[6]

HARA T, 1983, JPN J APPL PHYS, V22, P340

[7]

HARTSOUGH LD, 1984, J VAC SCI TECHNOL, V17, P1326

[8]

HARTSOUGH LD, 1979, SOLID STATE TECH DEC, P66

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[10] REACTIVE ION ETCHING INDUCED CORROSION OF AL AND AL-CU FILMS [J].

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ELDRIDGE, JM ;

SCHWARTZ, GC .