ELECTROMIGRATION EFFECTS IN ALUMINUM-ALLOY METALLIZATION

被引：41

作者：

LEARN, AJ ^{[1
]}

机构：

[1] FAIRCHILD CAMERA & INSTR CORP,RES & DEVEL LAB,PALO ALTO,CA 94304

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1974年 / 3卷 / 02期

关键词：

D O I：

10.1007/BF02652956

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：531 / 552

页数：22

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[8] EFFECT OF REDUNDANT MICROSTRUCTURE ON ELECTROMIGRATION-INDUCED FAILURE
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