DETERMINATION OF OXYGEN CONCENTRATION IN SINGLE-SIDE POLISHED CZOCHRALSKI-GROWN SILICON-WAFERS BY PARA-POLARIZED BREWSTER-ANGLE INCIDENCE INFRARED-SPECTROSCOPY

被引:14
作者
SHIRAI, H
机构
[1] Toshiba Ceramics Company, Limited, Research and Development Center, Kanagawa 257, 30 Soya, Hadano
关键词
D O I
10.1149/1.2085873
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Oxygen concentration has been determined in single-side polished Czochralski-grown silicon wafers as easily and precisely as in double-side polished wafers, by means of p-polarized Brewster angle incidence infrared spectroscopy. Interference fringes due to internal multiple reflections are scarcely observed in the p-polarized Brewster angle incidence absorption spectra of single-side polished wafers with a resolution of 1 cm-1. The infrared absorbance spectra are successfully analyzed to determine oxygen concentration in accordance with Lambert-Beer's law, which does not include multiple reflection contributions.
引用
收藏
页码:1784 / 1787
页数:4
相关论文
共 11 条
[1]  
[Anonymous], 1985, HDB OPTICAL CONSTANT
[2]   THE INFLUENCE OF SOME OPTICAL-PARAMETERS ON IR SPECTROSCOPY OF OXYGEN IN SILICON [J].
ENGELBRECHT, JAA ;
LOMBARD, OJ .
INFRARED PHYSICS, 1986, 26 (02) :75-81
[3]   A TECHNIQUE FOR OBTAINING THE INFRARED REFLECTIVITY OF BACK SIDE-DAMAGED SILICON SAMPLES [J].
ENGELBRECHT, JAA .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (01) :300-303
[5]  
GRAUPNER RK, 1983, ASTM STP, V804, P459
[6]  
Hild E., 1985, 1st International Autumn School 1985: Gettering and Defect Engineering in the Semiconductor Technology (GADEST). Proceedings, P264
[7]   DETERMINATION OF CONVERSION FACTOR FOR INFRARED MEASUREMENT OF OXYGEN IN SILICON [J].
IIZUKA, T ;
TAKASU, S ;
TAJIMA, M ;
ARAI, T ;
NOZAKI, T ;
INOUE, N ;
WATANABE, M .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (07) :1707-1713
[8]  
PAJOT B, 1977, ANALUSIS, V5, P293
[9]   CORRECTION FACTORS FOR THE DETERMINATION OF OXYGEN IN SILICON BY IR SPECTROMETRY [J].
SCHOMANN, F ;
GRAFF, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1989, 136 (07) :2025-2031
[10]  
Schwenk H., 1990, Materialpruefung, V32, P110