INFLUENCE OF SUBSTRATE TEMPERATURE AND DEPOSITION RATE ON STRUCTURE OF THICK SPUTTERED CU COATINGS

被引：410

作者：

THORNTON, JA ^{[1
]}

机构：

[1] TELIC CORP,1631 COLORADO AVE,SANTA MONICA,CA 90404

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1975年 / 12卷 / 04期

关键词：

D O I：

10.1116/1.568682

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

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页码：830 / 835

页数：6

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