EFFECT OF LEAD FRAME MATERIAL ON PLASTIC-ENCAPSULATED IC PACKAGE CRACKING UNDER TEMPERATURE CYCLING

被引：23

作者：

NISHIMURA, A ^{[1
]}

KAWAI, S ^{[1
]}

MURAKAMI, G ^{[1
]}

机构：

[1] HITACHI LTD,CTR SEMICOND DESIGN & DEV CTR,KODIRA,TOKYO 187,JAPAN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 04期

关键词：

D O I：

10.1109/33.49027

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：639 / 645

页数：7

共 14 条

[1]

BATHE KJ, 1978, MIT824481 REP

[2] SHEAR-STRESS EVALUATION OF PLASTIC PACKAGES [J].

EDWARDS, DR ;

HEINEN, KG ;

GROOTHUIS, SK ;

MARTINEZ, JE .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04) :618-627

[3]

Groothuis S., 1985, 23rd Annual Proceedings Reliability Physics 1985 (Cat. No. 85CH2113-9), P184, DOI 10.1109/IRPS.1985.362096

[4]

HOWELL JR, 1981, 19 IEEE INT REL PHYS, P104

[5]

LUNDSTROM P, 1988, 38TH P EL COMP C, P396

[6] NEW PROFILE OF ULTRA LOW STRESS RESIN ENCAPSULANTS FOR LARGE CHIP SEMICONDUCTOR-DEVICES [J].

NAKAMURA, Y ;

UENISHI, S ;

KUNISHI, T ;

MIKI, K ;

TABATA, H ;

KUWADA, K ;

SUZUKI, H ;

MATSUMOTO, T .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04) :502-506

[7] LIFE ESTIMATION FOR IC PLASTIC PACKAGES UNDER TEMPERATURE CYCLING BASED ON FRACTURE-MECHANICS [J].

NISHIMURA, A ;

TATEMICHI, A ;

MIURA, H ;

SAKAMOTO, T .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04) :637-642

[8]

Sajja V., 1985, Fifth Annual International Electronics Packaging Conference. Proceedings of the Technical Conference, P50

[9]

Shirley C. G., 1987, 25th Annual Proceedings: Reliability Physics 1987 (Cat. No.87CH2388-7), P238, DOI 10.1109/IRPS.1987.362185

[10] STRESS-INDUCED DEFORMATION OF ALUMINUM METALLIZATION IN PLASTIC MOLDED SEMICONDUCTOR-DEVICES [J].

THOMAS, RE .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (04) :427-434

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