CHARACTERIZATION OF INTERMETALLIC COMPOUND FORMATION ON IN/BI/SN SOLDER BUMPS USED IN PB-ALLOY JOSEPHSON CHIP PACKAGING

被引：10

作者：

FUJIWARA, K

ASAHI, M

机构：

[1] Naka-Gun, NTT, Electr Commun Lab, ,, Jpn, Naka-Gun, NTT, Electr Commun Lab, , Jpn

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期

关键词：

INDIUM/BISMUTH/TIN SOLDER BUMPS - INTERMETALLIC COMPOUND FORMATION - JOSEPHSON CHIP PACKAGING - LEAD-ALLOY SEQUENTIALLY DEPOSITED THICK SOLDER FILM;

D O I：

10.1109/TCHMT.1987.1134729

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：263 / 266

页数：4

共 4 条

[1]

FUJIWARA K, IN PRESS IEEE T COMP

HALL, PM ;

MORABITO, JM ;

POATE, JM .

[3] CONTROLLED COLLAPSE REFLOW FOR JOSEPHSON CHIP BONDING [J].

TING, CY ;

GREBE, K ;

WALDMAN, D .

YEH, JTC .

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1982, 13 (09) :1547-1562