THERMAL-STABILITY OF THE ALUMINUM TITANIUM CARBIDE SILICON CONTACT SYSTEM

被引：13

作者：

EIZENBERG, M ^{[1
]}

BRENER, R ^{[1
]}

MURARKA, SP ^{[1
]}

机构：

[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

JOURNAL OF APPLIED PHYSICS | 1984年 / 55卷 / 10期

关键词：

D O I：

10.1063/1.332888

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：3799 / 3803

页数：5

共 13 条

[1] INTERACTION OF REACTIVELY SPUTTERED TITANIUM CARBIDE THIN-FILMS WITH SI, SIO2TI, TISI2, AND AL [J].

EIZENBERG, M ;

MURARKA, SP ;

HEIMANN, PA .

JOURNAL OF APPLIED PHYSICS, 1983, 54 (06) :3195-3199

[2] REACTIVELY SPUTTERED TITANIUM CARBIDE THIN-FILMS - PREPARATION AND PROPERTIES [J].

EIZENBERG, M ;

MURARKA, SP .

JOURNAL OF APPLIED PHYSICS, 1983, 54 (06) :3190-3194

[3] KINETICS OF COMPOUND FORMATION IN THIN-FILM COUPLES OF AL AND TRANSITION-METALS [J].

HOWARD, JK ;

LEVER, RF ;

SMITH, PJ ;

HO, PS .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01) :68-71

[4] DIFFUSION BARRIERS IN THIN-FILMS [J].

NICOLET, MA .

THIN SOLID FILMS, 1978, 52 (03) :415-443

[5]

Smithells C. I., 1976, METALS REFERENCE BOO

[6]

TING CY, 1983, J APPL PHYS, V54, P699

[7] INTERFACIAL REACTIONS BETWEEN ALUMINUM AND TRANSITION-METAL NITRIDE AND CARBIDE FILMS [J].

WITTMER, M .

JOURNAL OF APPLIED PHYSICS, 1982, 53 (02) :1007-1012

[8]

JCPDS17424 JOINT COM

[9]

JCPDS10225 JOINT COM

[10]

JCPDS291362 JOINT CO

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