RESISTANCE, TEMPERATURE-COEFFICIENT OF RESISTANCE AND LONG-TERM STABILITY OF ANNEALED THIN NI-CR-SI FILMS

被引：8

作者：

GAWALEK, W

机构：

来源：

THIN SOLID FILMS | 1984年 / 116卷 / 1-3期

关键词：

D O I：

10.1016/0040-6090(84)90430-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：205 / 210

页数：6

共 13 条

[1]

ANKLAM J, 1980, 5TH WORK SEM INT THI

[2]

BERNER GR, 1973, THESIS EIDGENOSSISCH

[3] STRUCTURAL TRANSFORMATIONS INDUCED DURING THE ANNEALING OF THIN NI-CR FILMS [J].

BIRJEGA, MI ;

POPESCUPOGRION, N ;

SARBU, C ;

TEODORESCU, IA .

THIN SOLID FILMS, 1979, 57 (02) :337-341

[4]

BIRJEGA MI, 1968, THIN SOLID FILMS, V1, P396

[5]

BOHRER JJ, 1964, PHYSICS FAILURE ELEC, P338

[6] REACTIVE SPUTTERING OF NICR RESISTORS WITH CLOSELY ADJUSTABLE TEMPERATURE-COEFFICIENT OF RESISTANCE [J].

GRIESSING, J .

ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1977, 4 (3-4) :133-137

[7] AMORPHOUS CHROMIUM-SILICON - MATERIAL FOR KILO-OHM SHEET RESISTANCES [J].

HIEBER, K .

THIN SOLID FILMS, 1979, 57 (02) :353-357

[8] RESISTANCE STABILIZATION OF NI-CR FILMS BY SURFACE OXIDE FORMATION [J].

NOCERINO, G ;

SINGER, KE .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1979, 16 (02) :147-150

[9]

ROLKE J, 1981, ELECTROCOMP SCI TECH, V9, P51, DOI 10.1155/APEC.9.51

[10] COMPLETE THIN-FILM SYSTEM FOR HYBRID CIRCUITS SPUTTERED WITH THE PLASMATRON [J].

SCHILLER, S ;

HEISIG, U ;

GOEDICKE, K ;

BILZ, H ;

PFEIL, G ;

HENNEBERGER, J ;

VOGLER, G .

THIN SOLID FILMS, 1981, 83 (02) :165-172

← 1 2 →