COMPLETE THIN-FILM SYSTEM FOR HYBRID CIRCUITS SPUTTERED WITH THE PLASMATRON

被引：9

作者：

SCHILLER, S

HEISIG, U

GOEDICKE, K

BILZ, H

PFEIL, G

HENNEBERGER, J

VOGLER, G

机构：

[1] VEB KOMBINAT KERAMIN,HERMSDORF,GER DEM REP

[2] ACAD WISSENSCH DDR,ZENT INST FESTKORPERPHY & WERKSTDFFKUNDE,JENA,GER DEM REP

来源：

THIN SOLID FILMS | 1981年 / 83卷 / 02期

关键词：

D O I：

10.1016/0040-6090(81)90662-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：165 / 172

页数：8

共 11 条

[1] VERSATILE TA2N-W-AU-SIO2-AL-SIO2 THIN-FILM HYBRID MICROCIRCUIT METALLIZATION SYSTEM [J].

HAMPY, RE .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (04) :263-272

[2] ELECTRICAL AND STRUCTURAL-PROPERTIES OF NICR THIN-FILM RESISTORS REACTIVELY SPUTTERED IN O2 [J].

HARDY, WR ;

MURTI, DK .

THIN SOLID FILMS, 1974, 20 (02) :345-362

[3]

HEGNER F, 1978, VAKUUM-TECH, V27, P141

[4]

HEISIG U, 1980, 1ST P FACH TAG HYBR

[5]

KLEINEBERG J, 1976, Patent No. 185086

[6] STRUCTURAL AND ELECTRICAL PROPERTIES OF EVAPORATED CR-NI FILMS AS A FUNCTION OF GAS PRESSURE [J].

LASSAK, L ;

HIEBER, K .

THIN SOLID FILMS, 1973, 17 (01) :105-111

[7] MATERIAL CHARACTERIZATION OF TI-CU-NI-AU (TCNA) - NEW LOW-COST THIN-FILM CONDUCTOR SYSTEM [J].

MORABITO, JM ;

THOMAS, JH ;

LESH, NG .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (04) :253-262

[8]

SCHILLER S, 1981, VAKUUM-TECH, V30, P3

[9] ADVANCES IN HIGH-RATE SPUTTERING WITH MAGNETRON-PLASMATRON PROCESSING AND INSTRUMENTATION [J].

SCHILLER, S ;

HEISIG, U ;

GOEDICKE, K ;

SCHADE, K ;

TESCHNER, G ;

HENNEBERGER, J .

THIN SOLID FILMS, 1979, 64 (03) :455-467

[10] ROLE OF PLASMATRON-MAGNETRON SYSTEMS IN PHYSICAL VAPOR-DEPOSITION TECHNIQUES [J].

SCHILLER, S ;

HEISIG, U ;

GOEDICKE, K .

THIN SOLID FILMS, 1978, 54 (01) :33-47

← 1 2 →