ION-SCATTERING SPECTROSCOPY AND AUGER-ELECTRON SPECTROSCOPY DEPTH PROFILES OF SILVER COPPER THIN-FILM INTERDIFFUSION

被引：15

作者：

PITTS, JR

CZANDERNA, AW

THOMAS, TM

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 03期

关键词：

D O I：

10.1116/1.573991

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1671 / 1674

页数：4

共 24 条

[1]

BAYLIN JEE, 1979, J APPL PHYS, V50, P266

[2] ION BACKSCATTERING ANALYSIS OF INTERDIFFUSION IN CU-AU THIN-FILMS [J].

BORDERS, JA .

THIN SOLID FILMS, 1973, 19 (02) :359-370

[3]

Butrymowicz D. B., 1974, Journal of Physical and Chemical Reference Data, V3, P527, DOI 10.1063/1.3253145

[4] STABILITY OF INTERFACES IN SOLAR-ENERGY MATERIALS [J].

CZANDERNA, AW .

SOLAR ENERGY MATERIALS, 1981, 5 (04) :349-377

[5]

CZANDERNA AW, 1982, MATER SCI ENG, V53, P1

[6] INVESTIGATION OF DIFFUSION IN CU-AL THIN-FILM SYSTEM [J].

GERSHINSKII, AE ;

FOMIN, BI ;

CHEREPOV, EI ;

EDELMAN, FL .

THIN SOLID FILMS, 1977, 42 (03) :269-275

[7]

GOLDSTEIN JI, 1981, SCANNING ELECTRON MI

[8]

GUPTA D, 1978, THIN FILMS INTERDIFF, P299

[9] DIFFUSION MECHANISMS IN PD-AU THIN-FILM SYSTEM AND CORRELATION OF RESISTIVITY CHANGES WITH AUGER-ELECTRON SPECTROSCOPY AND RUTHERFORD BACKSCATTERING PROFILES [J].

HALL, PM ;

MORABITO, JM ;

POATE, JM .

THIN SOLID FILMS, 1976, 33 (01) :107-134

[10] INTERDIFFUSION IN CU-AU THIN-FILM SYSTEM AT 25DEGREESC TO 250DEGREESC [J].

HALL, PM ;

MORABITO, JM ;

PANOUSIS, NT .

THIN SOLID FILMS, 1977, 41 (03) :341-361

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