PASSIVELY ALIGNED HYBRID INTEGRATION OF 8X1 MICROMACHINED MICRO-FRESNEL LENS ARRAYS AND 8X1 VERTICAL-CAVITY SURFACE-EMITTING LASER ARRAYS FOR FREE-SPACE OPTICAL INTERCONNECT

被引：23

作者：

LEE, SS ^{[1
]}

LIN, LY ^{[1
]}

PISTER, KSJ ^{[1
]}

WU, MC ^{[1
]}

LEE, HC ^{[1
]}

GRODZINSKI, P ^{[1
]}

机构：

[1] MOTOROLA INC,PHOENIX CORP RES LABS,TEMPE,AZ 85287

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 1995年 / 7卷 / 09期

关键词：

Arrays - Integrated optoelectronics - Lasers - Micromachining - Optical instrument lenses - Three dimensional - VLSI circuits;

D O I：

10.1109/68.414692

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Surface micromachining technique has been successfully applied to the fabrications of a three-dimensional 8 x 1 micro-Fresnel lens array and other novel three-dimensional alignment structures, With the help of these three-dimensional structures, self-aligned integration of the micro-Fresnel lens array and an 8 x 1 vertical-cavity surface-emitting laser (VCSEL) array is realized for the first time with passive alignment. Individual addressing of the VCSEL/micro-lens element is also successfully demonstrated, With their three-dimensional and array structural characteristics, they are very attractive for free-space optical interconnect and other integrated micro-optical systems.

引用

页码：1031 / 1033

页数：3

共 9 条

[1] OPTICAL INTERCONNECTIONS FOR VLSI SYSTEMS [J].