GRAIN-BOUNDARY SOLUTE ELECTROMIGRATION IN POLYCRYSTALLINE FILMS

被引：36

作者：

HO, PS

HOWARD, JK

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

[2] IBM CORP,SYST PROD DIV,E FISHKILL,NY 12533

来源：

关键词：

D O I：

10.1063/1.1663763

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：3229 / 3233

页数：5

共 15 条

[11] INTERGRANULAR ELECTROMIGRATION OF ANTIMONY IN SILVER [J].

MARTIN, G .

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1972, 14 (01) :183-190

[12] MARKER MOTION DURING ELECTROMIGRATION IN THIN-FILMS [J].

OHRING, M ;

SUN, PH .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01) :284-&

[13] IMPURITY DIFFUSION IN ALUMINUM [J].

PETERSON, NL ;

ROTHMAN, SJ .

PHYSICAL REVIEW B, 1970, 1 (08) :3264-&

[14]

ROSENBERG R, 1970, APPL PHYS LETT, V16, P28

[15]

WHIPPLE RTP, 1954, PHILOS MAG, V45, P1225